Advanced Micro-Fabrication Equipment Inc Products
AMEC's independently developed Very High Frequency (VHF) "Decoupled Reactive Ion Etching Equipment" is used to process different dielectric materials such as 65/45/28-nm SiO, SiN and low K layer.
The high-productivity and high-performance reactor system can be configured with up to three dual-station reactors to improve the chips' processing output. Each reactor is able to process one or two chips simultaneously.
The patented innovation includes a plasma source of mixed very high and low radio frequency (RF) decoupled reactive ion etching equipment, a plasma isolating ring and a unique SiC showerhead design.
Key features and technological advantages
The de-coupled RIE and RF design enable independent control for ion density and energy.
Unique RF input and symmetrical distribution facilitate precise control for the etching process and chips' etching uniformity.
Proprietary dual plasma focusing ensures process stability with minimum particles.
An independent RF generator, uniformity control unit and endpoint control of each reactor station allow each wafer to be etched in a single environment. AMEC is the first company to enable a reactor to process one or two chips simultaneously.
Bottom-powered double RF offers stable plasma density and ion energy and ensures stable process and consistent results of all the stations.
Proprietary, self-isolated RF matches equipment with quick and stable frequency-tuning capability.
High-purity plasma-resistant chamber materials reduce the cost of consumables and the number of particles.
For more information about Primo D-RIE, please email firstname.lastname@example.org
Primo AD-RIE™ is AMEC's second-generation dielectric etch product for FEOL and BEOL applications. It targets processing wafers at 22 nm and below. Built on the proven capabilities and operation record of the first-generation product, Primo D-RIE, the Primo AD-RIE features advanced enhancements such as switchable LF RF, air flow distribution of upper electrodes and electrodes' temperature-controlled design.
Primo AD-RIE has passed the 3,000-wafer marathon test, confirming the product's reliability and repeatability, while demonstrating extremely precise critical dimension (CD) uniformity to within 2nm.
Key features and technological advantages
2-13.5 Mhz switchable RF provides a wider process window for multi-stack structures.
Unique RF input and symmetrical power distribution improve the uniformity of plasma density.
Triple-zone gas distribution ensures tunable etching uniformity.
E-chunk dual-zone cooling device improves wafers' temperature controllability for better etching uniformity performance.
For more information on the Primo AD-RIE, please email email@example.com
AMEC's Primo TSV200E™ is an 8-inch TSV etching product with ultra-high productivity used for packaging of 8-inch wafer microelectronics, MEMS and micro-electro-optical devices. The TSV tool delivers a 30 percent capital efficiency gain over other TSV etchers on the market.
3D IC technology is an essential element of the tiny System-on-Chip (SoC) that today's CMOS image sensors, LEDs, MEMS and other devices depend on. The new stacking approach became imperative as semiconductors' CDs feature size shrank. The smaller and complicated features require new balance between power and performance. By stacking chips, interconnects are shorter than traditional wire bonding. This offers improved package densities, faster data transfer and processor speed and lower power consumption – all in a smaller form factor.
Central to the Primo TSV200E tool is a dual-station reactor that enables single-or dual-wafer processing. The tool can be installed with up to three dual-station reactors. Compared to competitors' single-station reactor tools, this unique feature nearly doubles wafer throughput while cutting process costs. A de-coupled high-density plasma source and bias voltage increase the tool's etch rates at lower pressure and improves process control flexibility over a wide process window. Also AMEC's patented gas distribution design drives the etch rate and uniformity and optimizes process performance in the entire process regime, while an RF pulsing bias capability eliminates profile notching.
For more information on the Primo TSV200E, please email firstname.lastname@example.org
The patented architecture of Prismo D-BlueTM can accommodate up to 4 reactors, process up to 216 2-inch wafers simultaneously and extend to 4, 6 and 8-inch wafer production. Each reactor can be controlled independently—an inventive design that enables exceptional manufacturing flexibility. It is the only tool of its kind with this capability. This means it can process in parallel or sequential mode, which reduces cross-contamination and ensures the high crystalline quality required for advanced LED applications. The tool's footprint efficiency is unmatched—nearly 30 percent smaller than comparative single-reactor systems—making the Prismo a smarter fit for today's LED fabs.
Key Technology Features and Advantages
Exceptional Manufacturing Flexibility
Multi-reactor architecture is configured to handle up to 4 reactors. Each reactor can be controlled independently - the only tool of its kind with this capability. This novel design empowers customers with unprecedented production flexibility.
Superb Production Efficiency & Process Performance
Excellent uniformity, breakthrough repeatability and ultra-high reliability - even with virtually no recipe adjustments throughout the entire epitaxial process.
High uptime means longer intervals between service. Also, novel design features, as well as automated/programmable maintenance routines, makes for uncomplicated servicing.
Compact Footprint – A smarter fit for the LED Fab
The multi-reactor Prismo D-Blue is 30% smaller than comparative single-reactor tools, making it a neater fit for today's LED fabs.
For more information on the Prismo D-BLUETM, please email email@example.com
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